Journals Information

Environment and Ecology Research Vol. 2(5), pp. 209 - 220
DOI: 10.13189/eer.2014.020504
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Investigating the Process of Exporting Autodesk Ecotect Models to Detailed Thermal Simulation Software


Tamer Gado 1, Mady Mohamed 2,*
1 Dundee School of Architecture, University of Dundee, UK
2 Zagazig Department of Architecture, Zagazig University, Egypt

ABSTRACT

Autodesk Ecotect[1] is a whole building simulation software that can predict the thermal, visual and acoustic performance of buildings. It is very user-friendly software that could potentially integrate with the architectural design process. Thermal performance analysis in Autodesk Ecotect is based on the Chartered Institution of Building Services Engineers (CIBSE) admittance method and thus inherits its limitations. Hence, the need to use more detailed thermal simulation tools during the final stage of a building design or research project. This paper investigated the potential of using detailed thermal simulation software (HTB2) in conjunction with Autodesk Ecotect. Five primary classrooms built in a hot-dry climatic region were monitored. The same classrooms were modelled in Autodesk Ecotect using several modelling techniques and the internal temperatures were simulated using HTB2. Analysis of results suggested that a number of necessary measures are required to ensure the reliability and accuracy of the simulation results.

KEYWORDS
Thermal Simulation, Autodesk Ecotect Models, Primary Schools, Hot-Dry Climate, Building Thermal Performance, Computer Modelling

Cite This Paper in IEEE or APA Citation Styles
(a). IEEE Format:
[1] Tamer Gado , Mady Mohamed , "Investigating the Process of Exporting Autodesk Ecotect Models to Detailed Thermal Simulation Software," Environment and Ecology Research, Vol. 2, No. 5, pp. 209 - 220, 2014. DOI: 10.13189/eer.2014.020504.

(b). APA Format:
Tamer Gado , Mady Mohamed (2014). Investigating the Process of Exporting Autodesk Ecotect Models to Detailed Thermal Simulation Software. Environment and Ecology Research, 2(5), 209 - 220. DOI: 10.13189/eer.2014.020504.